We are happy to announce that part number TN2009 (Transistor) is now available and ready for immediate shipping! The NSN for part number TN2009 is 5961010898863. This part is manufactured by Xerox Corporation. Are you looking for the best quote for this part now? You can get an instant quote on this part as soon as you fill out the form.To ensure that you get your quotes quickly, make sure to fill out all the fields below, especially the asterisk (*) marked ones such as Need Parts By and Quantity (ea). Your quote for TN2009 will be calculated based on the values entered in these fields.
Part Number : TN2009 | Item Name : Transistor | NSN : 5961-01-089-8863 | FSC : 5961 Semiconductor Devices and Associated Hardware |
Manufacturer : Xerox Corporation | CAGE Code : 18338 |
Cogent Purchasing is an ASAP Semiconductor owned and operated website and one of the leading distributors of Xerox Corporation NSN parts in the USA. Our vast inventory consists of over 10 million unique National Stock Numbers (NSN), all ready to ship immediately. We ship parts across two major locations in the USA i.e California and sure that no matter what, we can offer you the best lead times and fastest delivery possible.
NSNs are 13-digit serial numbers assigned to items of the federal supply system by the Defense Logistics Agency (DLA), and used by the North Atlantic Treaty Organization (NATO). Are you interested in learning more about NSN 5340016616963 with part number 250SG1108-1? Please feel free to reach out and call us at our toll-free number, +1-714-705-4780, or email us your Bill of Materials (BOM) at sales@cogentpurchasing.com. If you want to get updates regarding our latest products and offers, download the ASAP Semiconductor mobile app from the App Store or Google Play.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-089-8863 Item Description: Transistor | 5961 | 010898863 | 0 | N | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | G | |||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Tn2009 | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | METAL |
ABHP | OVERALL LENGTH | 0.340 INCHES MAXIMUM |
ADAV | OVERALL DIAMETER | 0.620 INCHES MAXIMUM |
AKPV | MOUNTING FACILITY QUANTITY | 2 |
ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-66 |
AXGY | MOUNTING METHOD | UNTHREADED HOLE |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 90.0 MAXIMUM BREAKDOWN VOLTAGE, COLLECTOR-TO-BASE, EMITTER OPEN |
CTQX | CURRENT RATING PER CHARACTERISTIC | 4.00 AMPERES SOURCE CUTOFF CURRENT MAXIMUM AND 2.00 AMPERES SOURCE CUTOFF CURRENT MINIMUM |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
FEAT | SPECIAL FEATURES | JUNCTION PATTERN ARRANGEMENT: NPN |
PMLC | PRECIOUS MATERIAL AND LOCATION | LEADS COATING GOLD |
PRMT | PRECIOUS MATERIAL | GOLD |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD AND 1 CASE |
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