Get a Quote for 21049356-103 with NSN 5962013584070 of Bae Systems Information And Electronic Systems Integration I Dba Bae Systems Nor
We are happy to announce that part number 21049356-103 Microcircuit Memory is now available and ready for immediate shipping! The NSN for part number 21049356-103 is 5962013584070. This part is manufactured by Bae Systems Information And Electronic Systems Integration I Dba Bae Systems Nor. Are you looking for the best quote for this part now? You can get an instant quote on this part as soon as you fill out the form.To ensure that you get your quotes quickly, make sure to fill out all the fields below, especially the asterisk (*) marked ones such as Need Parts By and Quantity (ea). Your quote for 21049356-103 will be calculated based on the values entered in these fields.
| Part Number : 21049356-103 | Alternate P/N : 21049356103 | Item Name : Microcircuit Memory | NSN : 5962-01-358-4070 | FSC : 5962 Microcircuits Electronic |
| Manufacturer : Bae Systems Information And Electronic Systems Integration I Dba Bae Systems Nor | CAGE Code : 81395 |
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NSN Information for Part Number 21049356-103 with NSN 5962-01-358-4070, 5962013584070NSN FSC NIIN CLS Hazmat DEMIL Cancelled NSN 5962-01-358-4070
Item Description:Microcircuit Memory
5962 013584070 0 N B CIIC HCC ESD PMIC Criticality ENAC 7 B A 0 Part Number ISC RNVC RNCC HCC MSDS SADC 21049356-103 5 2 3
Characteristics Data of NSN 5962-01-358-4070, 5962013584070MRC Criteria Characteristic MEMORY ADAT BODY WIDTH0 510 INCHES MINIMUM AND 0 620 INCHES MAXIMUM MEMORY CWSG TERMINAL SURFACE TREATMENTSOLDER MEMORY CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC-2 0 VOLTS MINIMUM POWER SOURCE AND 7 0 VOLTS MAXIMUM POWER SOURCE MEMORY CZEQ TIME RATING PER CHACTERISTIC80 00 NANOSECONDS MAXIMUM DELAY MEMORY ADAU BODY HEIGHT0 155 INCHES MINIMUM AND 0 210 INCHES MAXIMUM MEMORY AEHX MAXIMUM POWER DISSIPATION RATING750 0 MILLIWATTS MEMORY CQSZ INCLOSURE CONFIGURATIONDUAL-IN-LINE MEMORY CQWX OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC MEMORY CQZP INPUT CIRCUIT PATTERN38 INPUT MEMORY TEST TEST DATA DOCUMENT96909-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC MEMORY ADAQ BODY LENGTH2 096 INCHES MAXIMUM MEMORY AFGA OPERATING TEMP RANGE-55 0125 0 DEG CELSIUS MEMORY CQSJ INCLOSURE MATERIALCERAMIC MEMORY CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY900 GATE ERASABLE PROGRAMMABLE LOGIC DEVICE MEMORY AFJQ STORAGE TEMP RANGE-65 0150 0 DEG CELSIUS MEMORY CBBL FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND ULTRAVIOLET ERASABLE MEMORY CTFT CASE OUTLINE SOURCE AND DESIGNATORD-5 MIL-M-38510 MEMORY CTQX CURRENT RATING PER CHARACTERISTIC100 00 MILLIAMPERES REVERSE CURRENT DC ABSOLUTE MEMORY CZEP CAPITANCE RATING PER CHARACTERISTIC20 00 INPUT PICOFARADS MAXIMUM AND 20 00 OUTPUT PICOFARADS MAXIMUM MEMORY CZER MEMORY DEVICE TYPEPAL MEMORY TTQY TERMINAL TYPE AND QUANTITY40 PRINTED CIRCUIT
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-358-4070 Item Description: Microcircuit Memory | 5962 | 013584070 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 21049356-103 | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| MEMORY | ADAT | BODY WIDTH0 510 INCHES MINIMUM AND 0 620 INCHES MAXIMUM |
| MEMORY | CWSG | TERMINAL SURFACE TREATMENTSOLDER |
| MEMORY | CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC-2 0 VOLTS MINIMUM POWER SOURCE AND 7 0 VOLTS MAXIMUM POWER SOURCE |
| MEMORY | CZEQ | TIME RATING PER CHACTERISTIC80 00 NANOSECONDS MAXIMUM DELAY |
| MEMORY | ADAU | BODY HEIGHT0 155 INCHES MINIMUM AND 0 210 INCHES MAXIMUM |
| MEMORY | AEHX | MAXIMUM POWER DISSIPATION RATING750 0 MILLIWATTS |
| MEMORY | CQSZ | INCLOSURE CONFIGURATIONDUAL-IN-LINE |
| MEMORY | CQWX | OUTPUT LOGIC FORMCOMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| MEMORY | CQZP | INPUT CIRCUIT PATTERN38 INPUT |
| MEMORY | TEST | TEST DATA DOCUMENT96909-MIL-STD-883 STANDARD INCLUDES INDUSTRY OR ASSOCIATION STANDARDS INDIVIDUAL MANUFACTUREER STANDARDS ETC |
| MEMORY | ADAQ | BODY LENGTH2 096 INCHES MAXIMUM |
| MEMORY | AFGA | OPERATING TEMP RANGE-55 0125 0 DEG CELSIUS |
| MEMORY | CQSJ | INCLOSURE MATERIALCERAMIC |
| MEMORY | CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY900 GATE ERASABLE PROGRAMMABLE LOGIC DEVICE |
| MEMORY | AFJQ | STORAGE TEMP RANGE-65 0150 0 DEG CELSIUS |
| MEMORY | CBBL | FEATURES PROVIDEDHERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND ULTRAVIOLET ERASABLE |
| MEMORY | CTFT | CASE OUTLINE SOURCE AND DESIGNATORD-5 MIL-M-38510 |
| MEMORY | CTQX | CURRENT RATING PER CHARACTERISTIC100 00 MILLIAMPERES REVERSE CURRENT DC ABSOLUTE |
| MEMORY | CZEP | CAPITANCE RATING PER CHARACTERISTIC20 00 INPUT PICOFARADS MAXIMUM AND 20 00 OUTPUT PICOFARADS MAXIMUM |
| MEMORY | CZER | MEMORY DEVICE TYPEPAL |
| MEMORY | TTQY | TERMINAL TYPE AND QUANTITY40 PRINTED CIRCUIT |
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